Digging Deeper into Lean/Six Sigma
in Complex Industries Webcast --
Endicott Interconnect Technologies
Generates Impressive Savings
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Executives go through the motions of deploying Lean/Six Sigma throughout their organizations only to find that it has evolved to another fad improvement program with delusionary results. Much of this can be traced back to severe weaknesses in five essential factors:
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- Leadership
- Business improvement strategy
- Deployment planning
- Change awareness
- Consistent communication
In September 2007, an IndustryWeek-hosted Webcast on Lean/Six Sigma in complex industries pointed out that these improvement tools have become a disappointment in many complex industries. As illustrated during that Webcast, Endicott Interconnect Technologies (EI) was in the early stages of its Lean/Six Sigma deployment called "Business Excellence," and the Webcast focused primarily on the planning, project selection, and launch activities EI had been pursuing. In a very short time, EI has achieved significant improvement using the Scaleable Lean/Six Sigma(tm) model, developed by the Center for Excellence in Operations (CEO) as a rapid deployment methodology for smaller and mid-sized organizations. EI's results, and its perseverance to drive strategic improvement into the culture of the organization, is a success story that has yielded impressive savings in only 12 months. On a scale of magnitude, its deployment is one of the quickest, largest savings initiatives ever observed by CEO.
This Webcast will update you on the great strides EI has taken in its Lean/Six Sigma deployment within a complex industry. Webcast presenters include Terry Burton, president of CEO, a management consulting firm specializing in Lean, Six Sigma, supply chain, and new product development. Burton will be joined by Brad VanBrunt, vice president of quality at EI, a world class supplier of electronic interconnect solutions and electro/mechanical equipment. EI specializes in the fabrication and assembly of complex printed circuit boards, advanced flip chip and wire bond semiconductor packaging and precision equipment manufacturing and integration.
Burton and VanBrunt will discuss their scaleable Lean/Six Sigma approach and share the results, lessons learned, and future plans to make "Business Excellence" the standard for how their employees think and work on a day-to-day basis.
Topics
- Endicott Interconnect Technologies
- Lean/Six Sigma Deployment and Results
- Critical Deployment Success Factors
Speaker
- Brad Kenney, Associate Editor, IndustryWeek
- Terence T. Burton, President, The Center for Excellence in Operations, Inc. (CEO)
- Brad VanBrunt, Vice President of Quality, Endicott Interconnect Technologies, Inc.